Chem Tinning

CHEMTIN 523 is a simple to operate, ready to use, room temperature, stable electroless tin plating solution. It will produce a thick level deposit of tin on copper and copper alloy surfaces, even if the substrate is highly oxidized.  It does not contain any hydrochloric acid and hence eliminating the heavy corrosive fuming atmosphere.  CHEMTIN 523 effectively cover exposed copper edges of etched solder plated boards, It also maintains good long term solderability when stored in normal atmosphere.